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Proceedings Paper

CCD and APS/CMOS technology for smart pixels and image sensors
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Paper Abstract

The relentless progress of semiconductor technology makes it possible to provide image sensors and pixels with additional analog and digital functionality. Growing experience with such photosensor functionality leads to the development of modular building blocks that can be employed for smart pixels, single-chip digital cameras and functional image sensors. Examples given include a non-linear pixel response circuit for high-dynamic range imaging offering a dynamic range of more than 180 dB, low-noise amplifiers and avalanche-effect pixels for high-sensitivity detection performance that approaches single-photoelectron resolution, lock-in pixels for optical time-of-flight range cameras with sub-centimeter distance resolution and in-pixel demodulation circuits for optical coherence tomography imaging. The future is seen in even higher levels of integration, such as system-on-a-chip machine vision cameras (“seeing chips”), post-processing with non-silicon materials for the extension of the detection range to the X-ray, ultraviolet and infrared spectrum, the exploitation of all properties of the incident light and imaging of fields other than electromagnetic radiation

Paper Details

Date Published: 19 February 2004
PDF: 12 pages
Proc. SPIE 5251, Detectors and Associated Signal Processing, (19 February 2004); doi: 10.1117/12.517150
Show Author Affiliations
Peter Seitz, Ctr. Suisse d'Electronique et de Microtechnique SA (Switzerland)
Nicolas Blanc, Ctr. Suisse d'Electronique et de Microtechnique SA (Switzerland)


Published in SPIE Proceedings Vol. 5251:
Detectors and Associated Signal Processing
Jean-Pierre Chatard; Peter N. J. Dennis, Editor(s)

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