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Proceedings Paper

Interferometry system for out-of-plane displacements and microshape measurements of silicon membranes
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Paper Abstract

In this paper we introduce a conventional interferometry system for MEMS/MOEMS characterization. We investigate the opto-mechanical properties of silicon micromembranes, where a thin film of PECVD SiOxNy was deposited. Monitoring the quality of this deposition we demonstrated the fabrication of technology for optical channel waveguides, compatible with the integration on micromechanical structures: based on low-stress and low-loss SiOxNy thin layers.

Paper Details

Date Published: 22 September 2003
PDF: 5 pages
Proc. SPIE 5124, Optoelectronic and Electronic Sensors V, (22 September 2003); doi: 10.1117/12.517118
Show Author Affiliations
Michal Jozwik, Univ. de Franche-Comté (France)
Institute of Micromechanics and Photonics (Poland)
Andrei Sabac, Univ. de Franche-Comté (France)
Christophe Gorecki, Univ. de Franche-Comté (France)


Published in SPIE Proceedings Vol. 5124:
Optoelectronic and Electronic Sensors V
Wlodzimierz Kalita, Editor(s)

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