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Proceedings Paper

Low-coherence speckle interferometer (LCSI) for characterisation of adhesion in adhesive-bonded joints
Author(s): Kay Gastinger; Svein Winther; Klaus D. Hinsch
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Paper Abstract

Low Coherence Speckle Interferometry (LCSI) combines the depth-resolved measurement of Low Coherence Interferometry (LCI) with the high-accuracy deformation measurement of Electronic Speckle Pattern Interferometry (ESPI). Depth-resolved deformation measurement enables the characterization of the behavior of interfaces in multi-layer materials or structures while changing the ambient conditions. In this paper LCSI is introduced as a new tool for characterization of adhesion. The experimental set-up and the principle of work are described. A FEM-model of an adhesive bonded aluminum joint is developed to analyze the behavior of the Al-adhesive interface during mechanical testing. Some recent results are shown. This application demand measurements on a microscopic scale (camera field of view down to 500 x 500 μm).

Paper Details

Date Published: 27 May 2003
PDF: 7 pages
Proc. SPIE 4933, Speckle Metrology 2003, (27 May 2003); doi: 10.1117/12.516577
Show Author Affiliations
Kay Gastinger, SINTEF Materials Technology (Norway)
Svein Winther, SINTEF Materials Technology (Norway)
Klaus D. Hinsch, Carl von Ossietzky Univ. Oldenburg (Germany)

Published in SPIE Proceedings Vol. 4933:
Speckle Metrology 2003
Kay Gastinger; Ole Johan Lokberg; Svein Winther, Editor(s)

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