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Proceedings Paper

Comparison of texture features for segmentation of patterned wafers
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Paper Abstract

In the last decade, the accessibility of inexpensive and powerful computers has allowed true digital holography to be used for industrial inspection using a microscopy. This technique allows capturing a complex image of a scene, and reconstructing the phase and magnitude information. This type of image gives a new dimension to texture analysis since the topology information can be used as an additional way to extract features. This new technique can be used to extend our previous work on image segmentation of patterned wafers for defect detection. This paper presents a comparison between the features obtained using Gabor filtering on complex (i.e. containing magnitude and phase) images under illumination and focus variations.

Paper Details

Date Published: 27 February 2004
PDF: 12 pages
Proc. SPIE 5266, Wavelet Applications in Industrial Processing, (27 February 2004); doi: 10.1117/12.516500
Show Author Affiliations
Pierrick Bourgeat, Oak Ridge National Lab. (United States)
Univ. de Bourgogne (France)
Fabrice Meriaudeau, Univ. de Bourgogne (France)
Kenneth W. Tobin Jr., Oak Ridge National Lab. (United States)
Patrick Gorria, Univ. de Bourgogne (France)

Published in SPIE Proceedings Vol. 5266:
Wavelet Applications in Industrial Processing
Frederic Truchetet, Editor(s)

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