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Proceedings Paper

Three approaches in infrared imaging of electronic devices
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Paper Abstract

We present further progress in high-resolution time-resolved thermal imaging of electronic and optoelectronic devices. We show that concurrent multi-spectral mapping of light, emissivity, and heat patterns a single device produces may hold the key of the device performance improvement by visualizing current carrier distribution and heat flows. To demonstrate advantage of this approach, thermal heaters, light emitting devices, and Peltier coolers are tested with emphasis laid on uniformity of carrier distribution and thermal control.

Paper Details

Date Published: 12 September 2003
PDF: 8 pages
Proc. SPIE 5092, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing VIII, (12 September 2003); doi: 10.1117/12.516466
Show Author Affiliations
Volodymyr K. Malyutenko, Institute of Semiconductor Physics (Ukraine)

Published in SPIE Proceedings Vol. 5092:
Technologies for Synthetic Environments: Hardware-in-the-Loop Testing VIII
Robert Lee Murrer, Editor(s)

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