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Proceedings Paper

High-accuracy microassembly by intelligent vision systems and smart sensor integration
Author(s): Johannes Schilp; Mark Harfensteller; Dirk Jacob; Michael Schilp
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Paper Abstract

Innovative production processes and strategies from batch production to high volume scale are playing a decisive role in generating microsystems economically. In particular assembly processes are crucial operations during the production of microsystems. Due to large batch sizes many microsystems can be produced economically by conventional assembly techniques using specialized and highly automated assembly systems. At laboratory stage microsystems are mostly assembled by hand. Between these extremes there is a wide field of small and middle sized batch production wherefore common automated solutions rarely are profitable. For assembly processes at these batch sizes a flexible automated assembly system has been developed at the iwb. It is based on a modular design. Actuators like grippers, dispensers or other process tools can easily be attached due to a special tool changing system. Therefore new joining techniques can easily be implemented. A force-sensor and a vision system are integrated into the tool head. The automated assembly processes are based on different optical sensors and smart actuators like high-accuracy robots or linear-motors. A fiber optic sensor is integrated in the dispensing module to measure contactless the clearance between the dispense needle and the substrate. Robot vision systems using the strategy of optical pattern recognition are also implemented as modules. In combination with relative positioning strategies, an assembly accuracy of the assembly system of less than 3 μm can be realized. A laser system is used for manufacturing processes like soldering.

Paper Details

Date Published: 30 September 2003
PDF: 9 pages
Proc. SPIE 5264, Optomechatronic Systems IV, (30 September 2003); doi: 10.1117/12.516110
Show Author Affiliations
Johannes Schilp, Technische Univ. Munchen (Germany)
Mark Harfensteller, Technische Univ. Munchen (Germany)
Dirk Jacob, Technische Univ. Munchen (Germany)
Michael Schilp, Technische Univ. Munchen (Germany)

Published in SPIE Proceedings Vol. 5264:
Optomechatronic Systems IV
George K. Knopf, Editor(s)

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