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Proceedings Paper

Smart sensor application in teleoperated microassembly systems
Author(s): Johannes Schilp; Michael Ehrenstrasser; Stella Clarke; Bernd Petzold; Michael F. Zaeh
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Paper Abstract

Micro-production is meeting new challenges due to the continuing miniaturization of modern products and the increasing variety of emerging hybrid microsystems, which are mainly produced manually. For small lot production, teleoperated micro-assembly systems offer new perspectives in improving manual assembly processes. By using smart sensor information, teleoperated systems enable an operator to feel physically present in a distant environment. In contrast to conventional sensor applications, smart sensors are encapsulated and intelligent sensor modules with integrated functions for data processing, status monitoring and autonomous dynamic parameter adaptation. To investigate the correlation between smart sensor data and immersion, a teleoperated micro-assembly system has been developed. To achieve a close-to-reality impression and to improve the dexterity of the operator, several smart sensor modules, including virtual sensors and shared sensor components, are integrated into the system. If required, sensor signals are enhanced and transformed into other modalities in order to control the micro-assembly system more intuitively. Due to flexibility requirements, all sensors are adaptable to new environments. Visual supervision is achieved through a precise optical system. All sensor components have been tested within an international teleoperation scenario consisting of a local operator in Munich, Germany, and a distant operator in Pittsburgh, USA.

Paper Details

Date Published: 4 March 2004
PDF: 12 pages
Proc. SPIE 5263, Intelligent Manufacturing, (4 March 2004); doi: 10.1117/12.516105
Show Author Affiliations
Johannes Schilp, Technische Univ. Muenchen (Germany)
Michael Ehrenstrasser, Technische Univ. Muenchen (Germany)
Stella Clarke, Technische Univ. Muenchen (Germany)
Bernd Petzold, Technische Univ. Muenchen (Germany)
Michael F. Zaeh, Technische Univ. Muenchen (Germany)


Published in SPIE Proceedings Vol. 5263:
Intelligent Manufacturing
Bhaskaran Gopalakrishnan; Peter E. Orban; Angappa Gunasekaran, Editor(s)

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