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Proceedings Paper

Scanning wafer thickness and flatness interferometer
Author(s): Maarten J. Jansen; Han Haitjema; Peter H.J. Schellekens
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Paper Abstract

Since the wafer industry is using an increasing amount of double side polished wafers, the future of wafer metrology is very likely to shift from capacitance gauging techniques to optical measurement techniques. Participating in an international project the Technical University of Eindhoven is developing a self calibrating, traceable double side wafer flatness and thickness measurement device. By using proper measurement principles and advanced software a robust and traceable wafer thickness and flatness measurement instrument is created which combines high lateral resolution, nanometer accuracy, high speed and low cost.

Paper Details

Date Published: 26 February 2004
PDF: 12 pages
Proc. SPIE 5252, Optical Fabrication, Testing, and Metrology, (26 February 2004); doi: 10.1117/12.515650
Show Author Affiliations
Maarten J. Jansen, Technische Univ. Eindhoven (Netherlands)
Han Haitjema, Technische Univ. Eindhoven (Netherlands)
Peter H.J. Schellekens, Technische Univ. Eindhoven (Netherlands)

Published in SPIE Proceedings Vol. 5252:
Optical Fabrication, Testing, and Metrology
Roland Geyl; David Rimmer; Lingli Wang, Editor(s)

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