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Proceedings Paper

Use of nanomachining for 100-nanometer mask repair
Author(s): Bob T. LoBianco; Roy White; Ted Nawrocki
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Paper Abstract

Nanomachining has recently been introduced as a new technology for subtractive repair of 130-nanometer masks. The RAVE LLC nml 300 utilizes this innovative strategy, facilitating repairs of all materials currently used in mask production. This technology has allowed 130- nanometer mask repair specifications to be met. This paper introduces nanomachining as a method of repairing next generation 100-nanometer masks. Emphasis will be given to materials and designs that provide significant challenges to current industry repair techniques; specifically quartz bumps on alternating phase shift masks and repairs within tight lines and spaces. Several advantages will be demonstrated, including the ability to machine within high aspect ratio features, the capability to duplicate edge slope, superior edge placement control, quartz bump repair, and transmission values approaching defect-free areas. This paper will compare performance to the SIA roadmap requirements for 100-nanometer mask repair using RAVE LLC' S next generation system, the nm1000.

Paper Details

Date Published: 28 May 2003
PDF: 13 pages
Proc. SPIE 5148, 19th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (28 May 2003); doi: 10.1117/12.515088
Show Author Affiliations
Bob T. LoBianco, RAVE LLC (United States)
Roy White, RAVE LLC (United States)
Ted Nawrocki, RAVE LLC (United States)


Published in SPIE Proceedings Vol. 5148:
19th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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