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Proceedings Paper

Integration of mask R&D and mask manufacturing to support the European semiconductor industry
Author(s): Markus Dilger
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Paper Abstract

The increasing gap between microelectronics minimum feature size and the exposure wavelength is a key challenge to the semiconductor industry. In the last 3 to 5 years mask technology has become a key contribute to bridge the sub wavelength gap. In particular optical enhancement technologies like Phase Shift Masks (PSM) technologies and Optical Proximity Correction (OPC) methods have become widely used tools to improve optical imaging. However the use of these technologies has increased the complexity of mask making. In particular control of the critical dimension (CD) and defect control including defect inspection face new challenges for advanced Phase Shift Masks. Inline with the increasing technology requirements the investment in mask technology is continuous increasing for a smaller volume of high end products which can afford costs of above I Mio. US $ for a mask set. Therefore new concepts are required to support semiconductor manufacturers with advanced, customer specific photomasks at reasonable costs. The Advanced Mask Technology Center (AMTC) concept was therefore jointly developed by the three partners Advanced Micro Devices (AMD), DuPont Photomask (DPI) and lnfineon Technologies (Infineon) for this purpose. The paper outlines the vision, the plans and the current status of the AMTC.

Paper Details

Date Published: 28 May 2003
PDF: 6 pages
Proc. SPIE 5148, 19th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (28 May 2003); doi: 10.1117/12.515067
Show Author Affiliations
Markus Dilger, Advanced Mask Technology Ctr. (Germany)

Published in SPIE Proceedings Vol. 5148:
19th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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