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Proceedings Paper

Semiconductor sidewall shape estimation using top-down CD-SEM image retrieval
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Paper Abstract

We present modifications to a feature-based, image-retrieval approach for estimating semiconductor sidewall (cross-section) shapes using top-down images. The top-down images are acquired by a critical dimension scanning electron microscope (CD-SEM). The proposed system is based upon earlier work with several modifications. First, we use only line-edge, as opposed to full-line, sub-images from the top-down images. Secondly, Gabor filter features are introduced to replace some of the previously computed features. Finally, a new dimensionality reduction algorithm - direct, weighted linear discriminant analysis (DW-LDA) - is developed to replace the previous two-step principal component analysis plus LDA method. Results of the modified system are presented for data collected across several line widths, line spacings, and CD-SEM tools.

Paper Details

Date Published: 1 May 2003
PDF: 11 pages
Proc. SPIE 5132, Sixth International Conference on Quality Control by Artificial Vision, (1 May 2003); doi: 10.1117/12.514963
Show Author Affiliations
Jeffery R. Price, Oak Ridge National Lab. (United States)
Philip R. Bingham, Oak Ridge National Lab. (United States)
Kenneth W. Tobin Jr., Oak Ridge National Lab. (United States)
Thomas P. Karnowski, Oak Ridge National Lab. (United States)


Published in SPIE Proceedings Vol. 5132:
Sixth International Conference on Quality Control by Artificial Vision
Kenneth W. Tobin Jr.; Fabrice Meriaudeau, Editor(s)

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