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Proceedings Paper

Performance of the aerial image measurement system for 157-nm lithography
Author(s): Peter Kuschnerus; Thomas Engel; Wolfgang Harnisch; Claudia Hertfelder; Axel M. Zibold; Jan-Peter Urbach; Christof M. Schilz; Klaus Eisner
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Paper Abstract

The first Aerial Image Measurement System (AIMSTM) for 157 nm lithography worldwide has been brought into operation successfully. Its performance will be demonstrated by AIMSTM measurements at 157 nm wavelength on binary chrome masks. Several through focus series have been measured in order to calculate the process windows for various structures with feature sizes at mask level of 300 nm and below. The latest results on enhanced illumination stability will be presented and a resolution that will enable an extension of the tool usage down to the 45 nm node. Using off-axis illumination 150 nm lines and spaces mask structures have been resolved.

Paper Details

Date Published: 28 May 2003
PDF: 9 pages
Proc. SPIE 5148, 19th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (28 May 2003); doi: 10.1117/12.514958
Show Author Affiliations
Peter Kuschnerus, Carl Zeiss Microelectronic Systems GmbH (Germany)
Thomas Engel, Carl Zeiss Microelectronic Systems GmbH (Germany)
Wolfgang Harnisch, Carl Zeiss Microelectronic Systems GmbH (Germany)
Claudia Hertfelder, Carl Zeiss Microelectronic Systems GmbH (Germany)
Axel M. Zibold, Carl Zeiss Microelectronic Systems GmbH (Germany)
Jan-Peter Urbach, International SEMATECH (United States)
Christof M. Schilz, Infineon Technologies AG (Germany)
Klaus Eisner, Infineon Technologies AG (Germany)


Published in SPIE Proceedings Vol. 5148:
19th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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