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Proceedings Paper

Accuracy vs. complexity: tradeoffs in OPC options
Author(s): Bartosz Banachowicz; Walter Iandolo; Artur P. Balasinski; Wolfgang Staud; Melody W. Ma; Jason Sweis
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Paper Abstract

Evolution of Optical Proximity Correction (OPC) methodology with the continuing shrink of feature size indicates a gradual shift towards increasingly more complex solutions, i.e., from rule based to model based OPC. The key underlying reason is to provide adequate accuracy ofpattern reproduction despite the growing sub-wavelength gap, i.e., the difference between minimum feature size and the wavelength used to print it [1 ]. However, full chip implementation of these complex solutions would increase CAD flow/mask generation runtimes and database file sizes, therefore compromising reticle manufacturability. In order to select optimal OPC routines based on feedback from process, CAD, design, and mask engineering, we proposed a methodology and investigated tradeoffs between correction accuracy and database complexity. Rule-based OPC, i.e., corrections defined by a set ofwidth and spacing proximity rules rely on a limited set oftest geometries and can't be made sensitive to the environment ofthe feature. In contrast, model based OPC features are generated for the actual layout environment and can be changed depending on the adopted photolithography process. Another degree of freedom is provided by the rule or model calibration. We defined and discussed complexity and accuracy criteria such as the size ofthe database and the number of silicon imaging errors.

Paper Details

Date Published: 28 May 2003
PDF: 10 pages
Proc. SPIE 5148, 19th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (28 May 2003); doi: 10.1117/12.514949
Show Author Affiliations
Bartosz Banachowicz, Cypress Semiconductor Corp. (United States)
Walter Iandolo, Cypress Semiconductor Corp. (United States)
Artur P. Balasinski, Cypress Semiconductor Corp. (United States)
Wolfgang Staud, Cadence Design Systems (United States)
Melody W. Ma, Cadence Design Systems (United States)
Jason Sweis, Cadence Design Systems (United States)


Published in SPIE Proceedings Vol. 5148:
19th European Conference on Mask Technology for Integrated Circuits and Microcomponents

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