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Proceedings Paper

Analysis challenges for reliability improvement in silicon micromachined devices
Author(s): M. K. Radhakrishnan
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Paper Abstract

Similar to silicon integrated circuits, the reliability improvement in MEMS devices starts with the very design and is a process involving all stages of manufacture and test. This process of building-in reliability is the resultant of various physical analyses to understand the failure mechanisms and to provide feedback to each stage for appropriate corrective actions. But, due to the structural uniqueness, the analysis of MEMS devices faces many challenges. Eventhough, a number of tools used for ICFA are being used for MEMS failure analysis, the methodology and application differs. An overview of the analysis issues for building-in reliability in MEMS devices is discussed.

Paper Details

Date Published: 14 October 2003
PDF: 7 pages
Proc. SPIE 5062, Smart Materials, Structures, and Systems, (14 October 2003); doi: 10.1117/12.514722
Show Author Affiliations
M. K. Radhakrishnan, Philips Electronics (Singapore)


Published in SPIE Proceedings Vol. 5062:
Smart Materials, Structures, and Systems
S. Mohan; B. Dattaguru; S. Gopalakrishnan, Editor(s)

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