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Proceedings Paper

Finite element analysis of structures with surface-bonded piezoelectric patches
Author(s): Dipak K. Maiti; E. Hemalatha; J. V. Kamesh; A. R. Upadhya
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Paper Abstract

This paper presents Finite Element analysis of structures with surface bonded piezoelectric patches. The objective of the present investigation is to develop layered piezoelectric elements which can be combined with the plate bending elements in a general purpose software such as MSC/NASTRAN, as a sensor/actuator for the analysis of smart structures. After thorough validation, numerical results are generated for various piezo-electric parameters.

Paper Details

Date Published: 14 October 2003
PDF: 8 pages
Proc. SPIE 5062, Smart Materials, Structures, and Systems, (14 October 2003); doi: 10.1117/12.514470
Show Author Affiliations
Dipak K. Maiti, Aeronautical Development Agency (India)
E. Hemalatha, Aeronautical Development Agency (India)
J. V. Kamesh, Aeronautical Development Agency (India)
A. R. Upadhya, Aeronautical Development Agency (India)


Published in SPIE Proceedings Vol. 5062:
Smart Materials, Structures, and Systems
S. Mohan; B. Dattaguru; S. Gopalakrishnan, Editor(s)

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