Share Email Print
cover

Proceedings Paper

Nondestructive testing of printed circuit board by phase-shifting interferometry
Author(s): Yueguang Lu; Lingzhen Jiang; Lixun Zou; Xia Zhao; Junyong Sun
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

In the paper, the principle of phase shifting interferometry has been briefly described. B using this technique to the non-destructive testing of solder joints on printed circuit board, the defective solder joints can be easily distinguished b the phase changes on the joints. A suitable aglorithm for the processing of the interferogram was also given. Keywords: Holographic interferometry, Non-destructive testing Phase-sh I ft

Paper Details

Date Published: 1 January 1991
PDF: 5 pages
Proc. SPIE 1332, Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection, (1 January 1991); doi: 10.1117/12.51078
Show Author Affiliations
Yueguang Lu, Harbin Institute of Technology (China)
Lingzhen Jiang, Harbin Institute of Technology (China)
Lixun Zou, Harbin Institute of Technology (China)
Xia Zhao, Harbin Institute of Technology (China)
Junyong Sun, Harbin Institute of Technology (Switzerland)


Published in SPIE Proceedings Vol. 1332:
Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection
Chander Prakash Grover, Editor(s)

© SPIE. Terms of Use
Back to Top