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Proceedings Paper

Application of real-time holographic interferometry in the nondestructive inspection of electronic parts and assemblies
Author(s): Craig P. Wood; James D. Trolinger
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Paper Abstract

Nondestructive inspection by holographic interferometry (HI) is quickly gaining acceptance in the electronics industry as a sensitive and accurate method of locating manufacturing and assembly flaws in a wide range of electronics, from individual components to assembled modules. This paper describes the specific application of real-time HI in the nondestructive analysis of circuit board heat exchangers and multiple-layer printed wiring boards to locate areas of debonding and delamination. In the application of HI, the choice of a stressing method is often as important as the choice of a specific HI technique. Methods for component stressing include thermal, vibrational, and pressure-induced stressing methods, and these are described in detail. In addition, two techniques for sensitivity enhancement, phase shift interferometry and beam tilt correction, are discussed in detail.

Paper Details

Date Published: 1 January 1991
PDF: 10 pages
Proc. SPIE 1332, Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection, (1 January 1991); doi: 10.1117/12.51064
Show Author Affiliations
Craig P. Wood, MetroLaser (United States)
James D. Trolinger, MetroLaser (United States)

Published in SPIE Proceedings Vol. 1332:
Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection
Chander Prakash Grover, Editor(s)

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