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Proceedings Paper

Laser-formed structures to facilitate TAB bonding
Author(s): Peter G. Ledermann; Glen W. Johnson; Mark B. Ritter
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Paper Abstract

A laser heating process was used to form structures which facilitate tape automated bonding (TAB). Uniform metal spheroids were created by melting the end of each TAB conductor intended for connection to the terminal pads of an integrated circuit (IC). A fully automated laser tool designed and built to fabricate these structures is described. Results for ICs bonded using this technology are presented.

Paper Details

Date Published: 1 December 1991
PDF: 4 pages
Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); doi: 10.1117/12.51037
Show Author Affiliations
Peter G. Ledermann, IBM/Thomas J. Watson Research Ctr. (United States)
Glen W. Johnson, IBM/Thomas J. Watson Research Ctr. (United States)
Mark B. Ritter, IBM/Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 1598:
Lasers in Microelectronic Manufacturing
Bodil Braren, Editor(s)

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