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Proceedings Paper

Laser process for personalization and repair of multichip modules
Author(s): Heinrich G. Mueller; Claire T. Galanakis; Scott C. Sommerfeldt; Tom J. Hirsch; Robert F. Miracky
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Paper Abstract

A process for fast personalization of multi-chip modules has been developed. Multilayer substrates with an incomplete top layer are prefabricated. Substrates are personalized within a few hours, using a frequency doubled Nd:YAG laser. 50 ns pulses with a pulse energy of 0.3 mJ are used for cutting. The same laser is also used for the direct writing of spot links, by decomposition of copper formate films with pulses of only 0.2 (mu) J at a repetition rate of 100 kHz. A detailed description of the applied copper formate technology is presented here.

Paper Details

Date Published: 1 December 1991
PDF: 9 pages
Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); doi: 10.1117/12.51034
Show Author Affiliations
Heinrich G. Mueller, Microelectronics and Computer Technology Corp. (United States)
Claire T. Galanakis, Microelectronics and Computer Technology Corp. (United States)
Scott C. Sommerfeldt, Microelectronics and Computer Technology Corp. (United States)
Tom J. Hirsch, Microelectronics and Computer Technology Corp. (United States)
Robert F. Miracky, Microelectronics and Computer Technology Corp. (United States)


Published in SPIE Proceedings Vol. 1598:
Lasers in Microelectronic Manufacturing
Bodil Braren, Editor(s)

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