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Proceedings Paper

Interfacial adhesive strength measurement in a multilayered two-level metal device structure
Author(s): Humayun R. Siddiqui; Vivian Ryan; Julie A. Shimer
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Paper Details

Date Published: 1 December 1991
PDF: 19 pages
Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); doi: 10.1117/12.51019
Show Author Affiliations
Humayun R. Siddiqui, AT&T Bell Labs. (United States)
Vivian Ryan, AT&T Bell Labs. (United States)
Julie A. Shimer, AT&T Bell Labs. (United States)


Published in SPIE Proceedings Vol. 1596:
Metallization: Performance and Reliability Issues for VLSI and ULSI
Gennady Sh. Gildenblat; Gary P. Schwartz, Editor(s)

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