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Proceedings Paper

Electromigration physical modeling of failure in thin film structures
Author(s): James R. Lloyd
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Paper Details

Date Published: 1 December 1991
PDF: 12 pages
Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); doi: 10.1117/12.51016
Show Author Affiliations
James R. Lloyd, Digital Equipment Corp. (United States)


Published in SPIE Proceedings Vol. 1596:
Metallization: Performance and Reliability Issues for VLSI and ULSI
Gennady Sh. Gildenblat; Gary P. Schwartz, Editor(s)

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