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Proceedings Paper

Electromigration physical modeling of failure in thin film structures
Author(s): James R. Lloyd
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Paper Abstract

Electromigration failure in thin film conductors is described. The state of the art in understanding is discussed and the results of new efforts in modeling this important failure mechanism are presented.

Paper Details

Date Published: 1 December 1991
PDF: 12 pages
Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); doi: 10.1117/12.51016
Show Author Affiliations
James R. Lloyd, Digital Equipment Corp. (United States)


Published in SPIE Proceedings Vol. 1596:
Metallization: Performance and Reliability Issues for VLSI and ULSI
Gennady Sh. Gildenblat; Gary P. Schwartz, Editor(s)

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