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Proceedings Paper

Stress-induced voiding in aluminum alloy metallizations
Author(s): Timothy D. Sullivan; James G. Ryan; J. R. Riendeau; Dennis P. Bouldin
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Paper Details

Date Published: 1 December 1991
PDF: 13 pages
Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); doi: 10.1117/12.51014
Show Author Affiliations
Timothy D. Sullivan, IBM/General Technology Div. (United States)
James G. Ryan, IBM/General Technology Div. (United States)
J. R. Riendeau, IBM/General Technology Div. (United States)
Dennis P. Bouldin, IBM/General Technology Div. (United States)


Published in SPIE Proceedings Vol. 1596:
Metallization: Performance and Reliability Issues for VLSI and ULSI
Gennady Sh. Gildenblat; Gary P. Schwartz, Editor(s)

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