Share Email Print
cover

Proceedings Paper

Laser-induced metal deposition and laser cutting techniques for fixing IC design errors
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The local modification of an integrated circuit (IC) requires in general the availability of three generic processes. First, a method for cutting conductors must be provided. Second, a process for depositing new conductors must be available. Finally, a means of opening via holes through the chip passivation to the underlying conductors is needed; this operation enables newly deposited conductors to make connections to the existing circuit elements, and also provides probe access to facilitate testing of the circuit.

Paper Details

Date Published: 1 December 1991
PDF: 5 pages
Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); doi: 10.1117/12.51010
Show Author Affiliations
David C. Shaver, Lincoln Lab./MIT (United States)
Scott P. Doran, Lincoln Lab./MIT (United States)
Mordechai Rothschild, Lincoln Lab./MIT (United States)
Jan H. C. Sedlacek, Lincoln Lab./MIT (United States)


Published in SPIE Proceedings Vol. 1596:
Metallization: Performance and Reliability Issues for VLSI and ULSI
Gennady Sh. Gildenblat; Gary P. Schwartz, Editor(s)

© SPIE. Terms of Use
Back to Top