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Proceedings Paper

Laser-induced metal deposition and laser cutting techniques for fixing IC design errors
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Paper Abstract

The local modification of an integrated circuit (IC) requires in general the availability of three generic processes. First, a method for cutting conductors must be provided. Second, a process for depositing new conductors must be available. Finally, a means of opening via holes through the chip passivation to the underlying conductors is needed; this operation enables newly deposited conductors to make connections to the existing circuit elements, and also provides probe access to facilitate testing of the circuit.

Paper Details

Date Published: 1 December 1991
PDF: 5 pages
Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); doi: 10.1117/12.51010
Show Author Affiliations
David C. Shaver, Lincoln Lab./MIT (United States)
Scott P. Doran, Lincoln Lab./MIT (United States)
Mordechai Rothschild, Lincoln Lab./MIT (United States)
Jan H. C. Sedlacek, Lincoln Lab./MIT (United States)

Published in SPIE Proceedings Vol. 1596:
Metallization: Performance and Reliability Issues for VLSI and ULSI
Gennady Sh. Gildenblat; Gary P. Schwartz, Editor(s)

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