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Proceedings Paper

Selective low-temperature chemical vapor deposition of copper from new copper(I) compounds
Author(s): Ajay Jain; H. K. Shin; Kai-Ming Chi; Mark J. Hampden-Smith; Toivo T. Kodas; Janos Farkas; M. T. Paffett; J. D. Farr
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Paper Details

Date Published: 1 December 1991
PDF: 11 pages
Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); doi: 10.1117/12.51008
Show Author Affiliations
Ajay Jain, Univ. of New Mexico (United States)
H. K. Shin, Univ. of New Mexico (United States)
Kai-Ming Chi, Univ. of New Mexico (United States)
Mark J. Hampden-Smith, Univ. of New Mexico (United States)
Toivo T. Kodas, Univ. of New Mexico (United States)
Janos Farkas, Univ. of New Mexico (United States)
M. T. Paffett, Los Alamos National Lab. (United States)
J. D. Farr, Los Alamos National Lab. (United States)


Published in SPIE Proceedings Vol. 1596:
Metallization: Performance and Reliability Issues for VLSI and ULSI
Gennady Sh. Gildenblat; Gary P. Schwartz, Editor(s)

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