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Proceedings Paper

Warpage measurement system with systematic error analysis
Author(s): Yu Qiu; Hai Ding; I. Charles Ume; Yilan Kang
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Paper Abstract

Out-of-plane displacement of the electronic package is an essential source of the electronic device failure. It is caused from the mismatch of the coefficient of thermal expansion among different parts of IC device. Here a projection Moire system is presented for monitoring and analyzing warpage during packaging. Projection Moire is particularly useful to measure warpage of surfaces with components. While this method shows promising features, it will give erroneous results if improperly used. In this paper, the formula of the systematic erro is deduced. Based onteh analysis, compensation could be done to eliminate the systematic error and guarantee an accurate measurement results.

Paper Details

Date Published: 29 April 2003
PDF: 6 pages
Proc. SPIE 5058, Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002, (29 April 2003); doi: 10.1117/12.509911
Show Author Affiliations
Yu Qiu, Tianjin Univ. (China)
Hai Ding, Georgia Institute of Technology (United States)
I. Charles Ume, Georgia Institute of Technology (United States)
Yilan Kang, Tianjin Univ. (China)


Published in SPIE Proceedings Vol. 5058:
Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002

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