Share Email Print

Proceedings Paper

Non-destructive test of multiply plywood using ESSPI with wide audio-frequency driving vibration
Author(s): Baohui Liu; Yunwen Qin; Ri Qu; Zhende Hou; Jin-Long Chen; Xinhua Ji
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper, the technique of electronic sheraing speckle pattern interferometry with wide Audio-frequency driving vibration is used in non-destructive test of the multiply plywood structure. Test results show that we are able to evaluate promply the soundness of bonding of the plywood. In the process of test not only can we find any locations of defects from the synthesized intensity map very quickly, but also can obtain the shape, size and resonant frequency of every interior defect of the multiply plywood accurately.

Paper Details

Date Published: 29 April 2003
PDF: 5 pages
Proc. SPIE 5058, Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002, (29 April 2003); doi: 10.1117/12.509771
Show Author Affiliations
Baohui Liu, Tianjin Univ. (China)
Yunwen Qin, Tianjin Univ. (China)
Ri Qu, Tianjin Univ. (China)
Zhende Hou, Tianjin Univ. (China)
Jin-Long Chen, Tianjin Univ. (China)
Xinhua Ji, Tianjin Univ. (China)

Published in SPIE Proceedings Vol. 5058:
Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002
Gong Xin Shen; Soyoung S. Cha; Fu-Pen Chiang; Carolyn R. Mercer, Editor(s)

© SPIE. Terms of Use
Back to Top