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Proceedings Paper

Beginning-to-end wafer bonding for advanced optical systems
Author(s): Shari N Farrens; Paul Lindner; Steven Dwyer; Markus Wimplinger
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Paper Abstract

The old adage "Work Smarter, Not Harder" is certainly applicable in today's competitive marketplace for Optical MEMS. In order to survive the current economic conditions, high volume manufacturers must get optimum performance and yield from each design and manufactured component. Wafer bonding, and its numerous variants, is entering mainstream production environments by providing solutions throughout the production flow. For example, SOI (silicon on insulator) and other laminated materials such as GaAs/Si are used as cost effective alternatives to molecular epitaxy methods for Bragg mirrors, rf resonators, and hybrid device fabrication. Temporary wafer bonding is used extensively to allow fragile compound semiconductors to be attached to rigid support wafers. This allows for front side and backside processing with a reduction in wafer breakage and increases in thickness uniformity results after backgrind operations. Permanent wafer bonding is used to attach compound semiconductors to each other or silicon to completely integrate optical components and logic or MEMS components. Permanent hermetic sealing is used for waveguide formation and, when combined with vacuum sealing, higher performance is achieved for RF resonators. Finally, many of the low temperature solders and eutectic alloys are finding application in low temperature wafer-to-wafer level packaging of optical devices to ceramic packages. Through clever application of these bonding methods, throughput increases and reduction in fabrication complexity givs a clear edge in the market place. This presentation will provide guidelines and process overviews needed to adopt wafer-to-wafer bonding technologies into the high volume-manufacturing environment.

Paper Details

Date Published: 10 November 2003
PDF: 6 pages
Proc. SPIE 5177, Gradient Index, Miniature, and Diffractive Optical Systems III, (10 November 2003); doi: 10.1117/12.507179
Show Author Affiliations
Shari N Farrens, EV Group Inc. (United States)
Paul Lindner, EV Group Inc. (Austria)
Steven Dwyer, EV Group Inc. (United States)
Markus Wimplinger, EV Group Inc. (United States)


Published in SPIE Proceedings Vol. 5177:
Gradient Index, Miniature, and Diffractive Optical Systems III
Thomas J. Suleski, Editor(s)

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