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Proceedings Paper

Diode laser soldering: a lumped parameter mathematical model and comparison of different optical soldering technologies
Author(s): Syed Mukarram Naveed; Robert L. Woods
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Paper Abstract

A lumped-parameter mathematical model has been developed for the laser soldering process and validated experimentally by measuring the temperature of solder preforms placed on a lead on a printed circuit board when heated with laser. This model results in four first-ordered nonlinear differential equations, which can be solved with MATLAB. Further, a comparison has been made between diode laser, and Soft Beam (xenon-arc white light) soldering with respect to the solder joint quality, cycle time and input optical energy requirements. In addition, scanning electron microscopic studies have been done to compare the microstructure of the solder and the formation of intermetallics, when the solder is melted with laser, Soft Beam and a conventional soldering iron. It is found that the diode laser soldered joint has a thinner intermetallic and finer grain size resulting in a higher mechanical strength.

Paper Details

Date Published: 19 June 2003
PDF: 16 pages
Proc. SPIE 4973, High-Power Diode Laser Technology and Applications, (19 June 2003); doi: 10.1117/12.505321
Show Author Affiliations
Syed Mukarram Naveed, Spectra Technologies Inc. (United States)
Robert L. Woods, Univ. of Texas at Arlington (United States)


Published in SPIE Proceedings Vol. 4973:
High-Power Diode Laser Technology and Applications
Mark S. Zediker, Editor(s)

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