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Proceedings Paper

A novel method for the measurement of the residual stress of surface-micromachined structures for MEMS
Author(s): Jong-Hoon Kim; Jeong-Gil Kim; Soon-Chang Yeon; Jun-Hee Hahn; Ho-Young Lee; Yong-Hyup Kim
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Paper Abstract

A simple, easy-to-use and reliable method called nano-bending method is proposed to measure the residual stresses of surface-micromachined structures for MEMS (Micro-Electro-Mechanical Systems). The basic concept is based on the fact that the linear bending stiffness of the surface-micromachined bridge is affected by the residual stress of the consisting materials. It is preferentially necessary to know anchor stiffness and bending stiffness of the surface-micromachined cantilevers in the stress free state which are composed of the same materials as the surface-micromachined bridges. The usefulness of the method was demonstrated by poly-silicon surface-micromachined structures under various residual stresses. The results indicated that the measured residual stress of the as-deposited poly-silicon film is 142.70 MPa with standard deviation of 3.5 percent and the compressive residual stress decreases as growing the annealing effect.

Paper Details

Date Published: 24 April 2003
PDF: 13 pages
Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.504384
Show Author Affiliations
Jong-Hoon Kim, Seoul National Univ. (South Korea)
Jeong-Gil Kim, Seoul National Univ. (South Korea)
Soon-Chang Yeon, Seoul National Univ. (South Korea)
Jun-Hee Hahn, Korea Research Institute of Standards and Science (South Korea)
Ho-Young Lee, Seoul National Univ. (South Korea)
Yong-Hyup Kim, Seoul National Univ. (South Korea)

Published in SPIE Proceedings Vol. 5116:
Smart Sensors, Actuators, and MEMS
Jung-Chih Chiao; Vijay K. Varadan; Carles Cané, Editor(s)

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