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Proceedings Paper

Applications of image diagnostics to metrology quality assurance and process control
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Paper Abstract

The purpose of this paper is to define standard methods for effective and efficient image-based dimensional metrology for microlithography applications in the manufacture of integrated circuits. This paper represents a consensual view of the co-authors, not necessarily in total agreement across all subjects, but in complete agreement on the fundamentals of dimensional metrology in this application. Fundamental expectations in the conventional comparison-based metrology of width are reviewed, with its reliance on calibration and standards, and how it is different from metrology of pitch and image placement. We discuss the wealth of a priori information in an image of a feature on a mask or a wafer. We define the estimates of deviations from these expectations and their applications to effective detection and identification of the measurement errors attributable to the measurement procedure or the metrology tool, as well as to the sample and the process o fits manufacture. Although many individuals and organizations already use such efficient methods, industry-wide standard methods do not exist today. This group of professionals expects that, by placing de facto standard meth-odologies into public domain, we can help reduce waste and risks inherent in a "spontaneous" technology build-out, thereby enabling a seamless proliferation of these methods by equipment vendors and users of dimensional metrology. Progress in this key technology, with the new dimensional metrology capabilities enabled, leads to improved perform-ance and yield of IC products, as well as increased automation and manufacturing efficiency, ensuring the long-term health of our industry.

Paper Details

Date Published: 10 July 2003
PDF: 27 pages
Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003); doi: 10.1117/12.504320
Show Author Affiliations
John A. Allgair, Motorola, Inc. (United States)
Victor V. Boksha, Boksha Global Partners LP (United States)
Benjamin D. Bunday, International SEMATECH (United States)
Alain C. Diebold, International SEMATECH (United States)
Daniel C. Cole, Boston Univ. (United States)
Mark P. Davidson, Spectel Research Corp. (United States)
Jerry Dan Hutcheson, VLSI Research, Inc. (United States)
Andrew W. Gurnell, M2C Services (United Kingdom)
David C. Joy, Univ. of Tennessee/Knoxville (United States)
John M. McIntosh
Sylvain G. Muckenhirn
Joseph C. Pellegrini, New Vision Systems (United States)
Robert D. Larrabee, National Institute of Standards and Technology (United States)
James E. Potzick, National Institute of Standards and Technology (United States)
Andras E. Vladar, National Institute of Standards and Technology (United States)
Nigel P. Smith, Accent Optical Technologies (United Kingdom)
Alexander Starikov, Intel Corp. (United States)
Neal T. Sullivan, Schlumberger Technologies, Inc. (United States)
Oliver C. Wells, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 5042:
Design and Process Integration for Microelectronic Manufacturing
Alexander Starikov, Editor(s)

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