Share Email Print
cover

Proceedings Paper

Implementation of SMIF in reticle production for front-end processes: impact on yield
Author(s): Renatus Sikorski; Annett Graeser
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

To improve the first pass defect level in a process, the implementation of a full Standard Machine Interface (SMIF) material handling system in first-level front end processes is a very effective method, due to the reduction of handling and clean-room particles on masks. The justification of such an investment into SMIF equipment is the corresponding increase in yield. Verification of this yield increase was done with data from Infineon maskhouse. Since the implementation was performed stepwise, a detailed defect data analysis had to be done. The total observed defect related yield enhancement SMIF implementation phase of approximately one year for the first level, was in the range of ~ 20%. To distinguish SMIF related improvements from other defect yield improvements during this time, the overall defect related yield was broken down into single process yields. The single process yield enhancements were calculated only with defects originating from particles at these process steps. The particle performance of SMIF pods was tested since the masks are put in the pods with chrome side up. Compared to conventional box types the particle adders due to pod handling on the masks in the SMIF pods was very low.

Paper Details

Date Published: 28 August 2003
PDF: 7 pages
Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); doi: 10.1117/12.504278
Show Author Affiliations
Renatus Sikorski, Infineon Technologies AG (Germany)
Annett Graeser, Infineon Technologies AG (Germany)


Published in SPIE Proceedings Vol. 5130:
Photomask and Next-Generation Lithography Mask Technology X
Hiroyoshi Tanabe, Editor(s)

© SPIE. Terms of Use
Back to Top