Share Email Print

Proceedings Paper

SMIF capability at Intel Mask Operation improves yield
Author(s): Thuc H. Dam; Matt Pekny; Jim Millino; Gibson Luu; Nitesh Melwani; Aparna Venkatramani; Malahat Tavassoli
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

At Intel Mask Operations (IMO), Standard Mechanical Interface (SMIF) processing has been employed to reduce environmental particle contamination from manual handling-related activities. SMIF handling entailed the utilization of automated robotic transfers of photoblanks/reticles between SMIF pods, whereas conventional handling utilized manual pick transfers of masks between SMIF pods with intermediate storage in Toppan compacts. The SMIF-enabling units in IMO's process line included: (1) coater, (2) exposure, (3) developer, (4) dry etcher, and (5) inspection. Each unit is equipped with automated I/O port, environmentally enclosed processing chamber, and SMIF pods. Yield metrics were utilized to demonstrate the effectiveness and advantages of SMIF processing compared to manual processing. The areas focused in this paper were blank resist coating, binary front-end reticle processing and 2nd level PSM reticle processing. Results obtained from the investigation showed yield improvements in these areas.

Paper Details

Date Published: 28 August 2003
PDF: 11 pages
Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); doi: 10.1117/12.504267
Show Author Affiliations
Thuc H. Dam, Intel Corp. (United States)
Matt Pekny, Intel Corp. (United States)
Jim Millino, Intel Corp. (United States)
Gibson Luu, Intel Corp. (United States)
Nitesh Melwani, Intel Corp. (United States)
Aparna Venkatramani, Intel Corp (United States)
Malahat Tavassoli, Intel Corp. (United States)

Published in SPIE Proceedings Vol. 5130:
Photomask and Next-Generation Lithography Mask Technology X
Hiroyoshi Tanabe, Editor(s)

© SPIE. Terms of Use
Back to Top