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Proceedings Paper

EUVL: transition from research to commercialization
Author(s): Charles W. Gwyn; Peter J. Silverman
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Paper Abstract

The Extreme Ultraviolet Lithography (EUVL) technology is transitioning from the basic research and technology demonstration phase into commercialization. All key EUVL system modules have been demonstrated with an Engineering Test Stand (ETS) and the system has been used to provide the basic learning for developing commercial EUVL tools. Full field scanned printing has been demonstrated. Full field masks have been produced and methods have been demonstrated for defect repair for both mask blanks and for patterned masks. Major European, Japanese, and US consortia in partnership with over 100 industrial companies are supporting the establishment of the EUVL infrastructure. The remaining challenges have been identified and laboratory and industrial support are continuing to reduce the risks for developing beta and production tools. Production tools are expected to be introduced in the 2007 time frame to support aggressively implementation of 45 nm node geometries with volume production support for the 32 nm node in 2009.

Paper Details

Date Published: 28 August 2003
PDF: 15 pages
Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); doi: 10.1117/12.504239
Show Author Affiliations
Charles W. Gwyn, EUV LLC (United States)
Intel Corp. (United States)
Peter J. Silverman, EUV LLC (United States)
Intel Corp. (United States)

Published in SPIE Proceedings Vol. 5130:
Photomask and Next-Generation Lithography Mask Technology X
Hiroyoshi Tanabe, Editor(s)

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