Share Email Print
cover

Proceedings Paper

Evaluation of EA-PSM opaque repair on 90-nm lithography
Author(s): Dae-Woo Kim; Jung-Kwan Lee; Sang-Hoi Koo; Dong-Heok Lee; Jin-Min Kim; Sang-Soo Choi
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Increasing complexity, smaller design rule and development of PSM (Phase Shift Mask) are required more precise photomask repair technology. Recently, It is important unit process to enhance yield, production time and delivery in 130nm node below mass production. Furthermore, opaque defects are on the increase compare to clear defects using dry process. Therefore key issue of advanced repair technology is opaque defects removal and edge placement accuracy control. In this paper, we will discuss opaque repair technology of 90nm node EA-PSM to get improved edge placement using FIB (Focused Ion Beam) machine. Firstly, we started with a concept of low ion beam current at 30keV acceleration voltage. To optimize image quality in low beam current, we have changed suitable scan parameters in target FOV (Field Of View) and checked scan damage in these parameters with AIMS. Secondly, we have applied a reregistration function to enhance edge placement control and analyzed edge placement variation by CD-SEM and AIMS tool after pattern drift. Thirdly, transmission of repaired region was confirmed with AIMS and inspection tool.

Paper Details

Date Published: 28 August 2003
PDF: 12 pages
Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); doi: 10.1117/12.504210
Show Author Affiliations
Dae-Woo Kim, Photronics-PKL (South Korea)
Jung-Kwan Lee, Photronics-PKL (South Korea)
Sang-Hoi Koo, Photronics-PKL (South Korea)
Dong-Heok Lee, Photronics-PKL (South Korea)
Jin-Min Kim, Photronics-PKL (South Korea)
Sang-Soo Choi, Photronics-PKL (South Korea)


Published in SPIE Proceedings Vol. 5130:
Photomask and Next-Generation Lithography Mask Technology X
Hiroyoshi Tanabe, Editor(s)

© SPIE. Terms of Use
Back to Top