Share Email Print
cover

Proceedings Paper

Initial capability of new photomask-blank deposition tool
Author(s): Michael D. Kriese; James L. Wood; James R. Rodriguez; Gary Fournier; David L. Thompson; David Mercer; Jason A. Gass; Dale E. Mauldin
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

In a joint-development, Rohwedder and Osmic have designed and built a low-defect dual-ion beam reactive-sputtering tool. The tool has been specifically targeted for developing low-defect lithography mask photoblank coatings intended as DUV absorbers and phase-shifting films. The Osmic/Rohwedder collaboration will continue into NGL -- the present tool also serves as an R&D platform for EUVL mask blanks. The deposition tool and robotic substrate handler have been integrated and delivered to Osmic in the 2nd quarter of 2003. In this paper, we present initial capability for production of thin-film lithography coatings, including spectrophotometric performance, defect levels and film uniformity. Future reports will share results from more in-depth process development and optimization.

Paper Details

Date Published: 28 August 2003
PDF: 9 pages
Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); doi: 10.1117/12.504179
Show Author Affiliations
Michael D. Kriese, Osmic, Inc. (United States)
James L. Wood, Osmic, Inc. (United States)
James R. Rodriguez, Osmic, Inc. (United States)
Gary Fournier, Osmic, Inc. (United States)
David L. Thompson, Rohwedder Inc. (United States)
David Mercer, Rohwedder Inc. (United States)
Jason A. Gass, Rohwedder Inc. (United States)
Dale E. Mauldin, Rohwedder Inc. (United States)


Published in SPIE Proceedings Vol. 5130:
Photomask and Next-Generation Lithography Mask Technology X
Hiroyoshi Tanabe, Editor(s)

© SPIE. Terms of Use
Back to Top