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Proceedings Paper

Investigation of phase variation impact on CPL PSM for low k1 imaging
Author(s): Chun-hung Lin; Michael Hsu; Frank Hsieh; Shu Yi Lin; Stephen D. Hsu; Xuelong Shi; Douglas J. Van Den Broeke; J. Fung Chen; F. C. Tang; W. A. Hsieh; C. Y. Huang
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Paper Abstract

From 90nm node and beyond, all of the advanced silicon wafer manufacturing processes are likely to heavily depend on the use of PSM. Two styles of PSM have been considered favorably for both 90nm and 65nm nodes, one is the 6% attenuated PSM and the other one is Chromeless Phase Lithography (CPL) mask. At 65nm node, both of the MoSi-based attenuated PSM and CPL mask are required to be etched into quartz substrate to achieve the desired pi-phase shift. In addition to the demand for very tight top-down mask CD control, for dry-etched process, there are two critical factors can have a significant impact to wafer CD control. They are the etch depth control through feature pitch and the overall etch slope profile. Both contribute to the phase variation. The phase variation degrades the overlapped process window and sufficient phase error can act like spherical lens aberration. This will no doubt impact the wafer imaging performance. In this work, we characterize our dry-etch process by using an orthogonal experiment method and then examine the performance of the optimized recipe by CD metrology, phase uniformity, and actual wafer printing result.

Paper Details

Date Published: 28 August 2003
PDF: 8 pages
Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); doi: 10.1117/12.504176
Show Author Affiliations
Chun-hung Lin, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Michael Hsu, ASML MaskTools, Inc. (United States)
Frank Hsieh, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Shu Yi Lin, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Stephen D. Hsu, ASML MaskTools, Inc. (United States)
Xuelong Shi, ASML MaskTools, Inc. (United States)
Douglas J. Van Den Broeke, ASML MaskTools, Inc. (United States)
J. Fung Chen, ASML MaskTools, Inc. (United States)
F. C. Tang, Winbond Electronics Corp. (Taiwan)
W. A. Hsieh, Winbond Electronics Corp. (Taiwan)
C. Y. Huang, Winbond Electronics Corp. (Taiwan)

Published in SPIE Proceedings Vol. 5130:
Photomask and Next-Generation Lithography Mask Technology X
Hiroyoshi Tanabe, Editor(s)

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