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Proceedings Paper

Inspection of aggressive OPC using aerial image-based mask inspection
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Paper Abstract

Inspection of aggressive OPC represents one of the major challenges for today's mask inspection methodologies. Systems are phased with high-density layouts, containing OPC features far below the resolution limit of conventional inspection systems. This causes large amounts of false and nuisance defects, especially on production applications. The paper presents the use of Aera193, a new inspection system using aerial imaging as inspection methodology.

Paper Details

Date Published: 28 August 2003
PDF: 7 pages
Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); doi: 10.1117/12.504058
Show Author Affiliations
Luke T. H. Hsu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Johnson Chang-Cheng Hung, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Hong-Chang Hsieh, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Anja Rosenbusch, Etec Systems, Inc., an Applied Materials Co. (United States)
Reuven Falah, Etec Systems, Inc., an Applied Materials Co. (Israel)
Yuval Blumberg, Etec Systems, Inc., an Applied Materials Co. (Israel)


Published in SPIE Proceedings Vol. 5130:
Photomask and Next-Generation Lithography Mask Technology X
Hiroyoshi Tanabe, Editor(s)

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