Share Email Print
cover

Proceedings Paper

Thermal management in high-power electronics cooled down using capillary pump
Author(s): Boguslaw Wiecek; Tomasz Wajman; Mariola Felczak; Marek Berlinski
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

By using the evaporation of working fluid in the capillary it is possible to design and build cooling device, with high cooling effectiveness. This paper presents a preliminary cooling system integrated with electronic device., which is supported by evaporation and capillarity effects. A simplified modeling of conjugate heat transfer including evaporation using FLUENT package is discussed. The experiments for open and close loop capillary pomp are shown to compare and verify the measurements and simulation results.

Paper Details

Date Published: 1 April 2003
PDF: 7 pages
Proc. SPIE 5073, Thermosense XXV, (1 April 2003); doi: 10.1117/12.503889
Show Author Affiliations
Boguslaw Wiecek, Technical Univ. of Lodz (Poland)
Tomasz Wajman, Technical Univ. of Lodz (Poland)
Mariola Felczak, Technical Univ. of Lodz (Poland)
Marek Berlinski, Technical Univ. of Lodz (Poland)


Published in SPIE Proceedings Vol. 5073:
Thermosense XXV
K. Elliott Cramer; Xavier P. Maldague, Editor(s)

© SPIE. Terms of Use
Back to Top