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Proceedings Paper

Active microelement testing by interferometry using time-average and quasi-stroboscopic techniques
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Paper Abstract

Increasing technological capabilities to produce active microelements (incl. microbeams, micromembranes and micromirrors) and their expanding areas of application introduce unprecedented requirements concerning their design and testing. The paper presents a concept of an optical measurement system and methodology for out-of-plane displacement testing of such active microelements. The system is based on Twyman-Green microinterferometer. It gives the possibility to combine the capabilities of time average and quasi-stroboscopic interferometry methods to find dynamic behavior of active microelements (e.g., resonance frequencies and amplitude distributions in vibration modes). For mapping the zero-order Bessel function modulating the contrast of two-beam interference fringes the four-frame technique is applied. The calibration of the contrast variation in time-averaged interferograms enables quantitative evaluation of the vibration amplitude encoded in the argument of the Bessel function. For qualitative estimation of the vibration amplitude sign a simple quasi-stroboscopic technique is proposed. In this technique, laser pulses have the same frequency as the signal activating the microelement under test. This self-synchronous system enables to visualize the shape of the tested element at maximum deflection. Exemplary results of measurements performed with active micromembranes are presented.

Paper Details

Date Published: 3 October 2003
PDF: 10 pages
Proc. SPIE 5145, Microsystems Engineering: Metrology and Inspection III, (3 October 2003); doi: 10.1117/12.500747
Show Author Affiliations
Leszek A. Salbut, Warsaw Univ. of Technology (Poland)
Krzysztof Patorski, Warsaw Univ. of Technology (Poland)
Michal Jozwik, Warsaw Univ. of Technology (Poland)
LOPMD, Univ. de Franche-Comte, CNRS (France)
Jacek Marcin Kacperski, Warsaw Univ. of Technology (Poland)
Christophe Gorecki, LOPMD, Univ. de Franche-Comte, CNRS (France)
Alain Jacobelli, Thales Research & Technology France (France)
Thierry Dean, Thales Research & Technology France (France)

Published in SPIE Proceedings Vol. 5145:
Microsystems Engineering: Metrology and Inspection III
Christophe Gorecki, Editor(s)

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