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Proceedings Paper

Investigation of silion MEMS structures subjected to thermal loading by digital holography
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Paper Abstract

In this paper we study silicon MEMS (Microelectromechanical systems) structures subjected to thermal loading. Digital holography has been investigated as inspection tool to evaluate the deformation induced by the thermal loading. Application of DH on structures with several different geometries and shapes, like cantilever beams, bridges and membranes is reported and result will be discussed. Dimensions of the inspected microstructures, varies in the range 1÷50μm. The experimental results shown that a "bimorph-effect" induces a deformation in MEMS structures. The difficulties encountered in performing the deformation analysis by digital holography in real-time will be afforded and discussed. A method with automatic focus tracking in Digital Holography is proposed allowing inspection of MEMS, under thermal loading, in real-time.

Paper Details

Date Published: 3 October 2003
PDF: 9 pages
Proc. SPIE 5145, Microsystems Engineering: Metrology and Inspection III, (3 October 2003); doi: 10.1117/12.500657
Show Author Affiliations
Pietro Ferraro, Istituto per la Microelettronica e i Microsistemi, CNR (Italy)
Sergio De Nicola, Istituto di Cibernetica (Italy)
Andrea Finizio, Istituto di Cibernetica (Italy)
Giuseppe Coppola, Istituto per la Microelettronica e i Microsistemi, CNR (Italy)
Mario Iodice, Istituto per la Microelettronica e i Microsistemi, CNR (Italy)
Simonetta Grilli, Istituto Nazionale di Ottica Applicata (Italy)
Carlo Magro, STMicroelectronics srl (Italy)
Giovanni Pierattini, Istituto di Cibernetica, CNR (Italy)


Published in SPIE Proceedings Vol. 5145:
Microsystems Engineering: Metrology and Inspection III
Christophe Gorecki, Editor(s)

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