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Proceedings Paper

Adhesive wafer bonding for MEMS applications
Author(s): Viorel Dragoi; Thomas Glinsner; Gerald Mittendorfer; Bernhard Wieder; Paul Lindner
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Paper Abstract

Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding. This paper presents results on adhesive bonding using spin-on glass and Benzocyclobutene (BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated be presenting a technology of fabricating GaAs-on-Si substrates (up to 150 mm diameter) and results on BCB bonding of Si wafers (200 mm diameter).

Paper Details

Date Published: 24 April 2003
PDF: 8 pages
Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.499077
Show Author Affiliations
Viorel Dragoi, EV Group E. Thallner GmbH (Austria)
Thomas Glinsner, EV Group E. Thallner GmbH (Austria)
Gerald Mittendorfer, EV Group E. Thallner GmbH (Austria)
Bernhard Wieder, EV Group E. Thallner GmbH (Austria)
Paul Lindner, EV Group E. Thallner GmbH (Austria)

Published in SPIE Proceedings Vol. 5116:
Smart Sensors, Actuators, and MEMS
Jung-Chih Chiao; Vijay K. Varadan; Carles Cané, Editor(s)

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