Share Email Print
cover

Proceedings Paper

Optical MEMS devices for telecom systems
Author(s): Flavio Pardo; Vladimir A. Aksyuk; Susanne Arney; H. Bair; Nagesh R. Basavanhally; David J. Bishop; Gregory R. Bogart; Cristian A. Bolle; J. E. Bower; Dustin Carr; H. B. Chan; Raymond A. Cirelli; E. Ferry; Robert E. Frahm; Arman Gasparyan; John V. Gates; C. Randy Giles; L. Gomez; Suresh Goyal; Dennis S. Greywall; Martin Haueis; R. C. Keller; Jungsang Kim; Fred P. Klemens; Paul R. Kolodner; Avi Kornblit; T. Kroupenkine; Warren Y.-C. Lai; Victor Lifton; Jian Liu; Yee L. Low; William M. Mansfield; Dan Marom; John F. Miner; David T. Neilson; Mark A. Paczkowski; C. S. Pai; A. G. Ramirez; David A. Ramsey; S. Rogers; Roland Ryf; Ronald E. Scotti; Herbert R. Shea; M. E. Simon; H. T. Soh; Hong Tang; J. A. Taylor; K. Teffeau; Joseph Vuillemin; J. Weld
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

As telecom networks increase in complexity there is a need for systems capable of manage numerous optical signals. Many of the channel-manipulation functions can be done more effectively in the optical domain. MEMS devices are especially well suited for this functions since they can offer large number of degrees of freedom in a limited space, thus providing high levels of optical integration. We have designed, fabricated and tested optical MEMS devices at the core of Optical Cross Connects, WDM spectrum equalizers and Optical Add-Drop multiplexors based on different fabrication technologies such as polySi surface micromachining, single crystal SOI and combination of both. We show specific examples of these devices, discussing design trade-offs, fabrication requirements and optical performance in each case.

Paper Details

Date Published: 24 April 2003
PDF: 10 pages
Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.499075
Show Author Affiliations
Flavio Pardo, Lucent Technologies/Bell Labs. (United States)
Vladimir A. Aksyuk, Lucent Technologies/Bell Labs. (United States)
Susanne Arney, Lucent Technologies/Bell Labs. (United States)
H. Bair, Lucent Technologies/Bell Labs. (United States)
Nagesh R. Basavanhally, Lucent Technologies/Bell Labs. (United States)
David J. Bishop, Lucent Technologies/Bell Labs. (United States)
Gregory R. Bogart, Lucent Technologies/Bell Labs. (United States)
Cristian A. Bolle, Lucent Technologies/Bell Labs. (United States)
J. E. Bower, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
Dustin Carr, Lucent Technologies/Bell Labs. (United States)
H. B. Chan, Lucent Technologies/Bell Labs. (United States)
Raymond A. Cirelli, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
E. Ferry, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
Robert E. Frahm, Lucent Technologies/Bell Labs. (United States)
Arman Gasparyan, Lucent Technologies/Bell Labs. (United States)
John V. Gates, Lucent Technologies/Bell Labs. (United States)
C. Randy Giles, Lucent Technologies/Bell Labs. (United States)
L. Gomez, Lucent Technologies/Bell Labs. (United States)
Suresh Goyal, Lucent Technologies/Bell Labs. (United States)
Dennis S. Greywall, Lucent Technologies/Bell Labs. (United States)
Martin Haueis, Lucent Technologies/Bell Labs. (United States)
R. C. Keller, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
Jungsang Kim, Lucent Technologies/Bell Labs. (United States)
Fred P. Klemens, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
Paul R. Kolodner, Lucent Technologies/Bell Labs. (United States)
Avi Kornblit, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
T. Kroupenkine, Lucent Technologies/Bell Labs. (United States)
Warren Y.-C. Lai, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
Victor Lifton, Lucent Technologies/Bell Labs. (United States)
Jian Liu, Lucent Technologies/Bell Labs. (United States)
Yee L. Low, Lucent Technologies/Bell Labs. (United States)
William M. Mansfield, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
Dan Marom, Lucent Technologies/Bell Labs. (United States)
John F. Miner, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
David T. Neilson, Lucent Technologies/Bell Labs. (United States)
Mark A. Paczkowski, Lucent Technologies/Bell Labs. (United States)
C. S. Pai, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
A. G. Ramirez, Lucent Technologies/Bell Labs. (United States)
David A. Ramsey, Lucent Technologies/Bell Labs. (United States)
S. Rogers, Lucent Technologies/Bell Labs. (United States)
Roland Ryf, Lucent Technologies/Bell Labs. (United States)
Ronald E. Scotti, Lucent Technologies/Bell Labs. (United States)
Herbert R. Shea, Lucent Technologies/Bell Labs. (United States)
M. E. Simon, Lucent Technologies/Bell Labs. (United States)
H. T. Soh, Lucent Technologies/Bell Labs. (United States)
Hong Tang, Lucent Technologies/Bell Labs. (United States)
J. A. Taylor, Lucent Technologies/Bell Labs. (United States)
New Jersey Nanotechnology Consortium (United States)
K. Teffeau, Lucent Technologies/Bell Labs. (United States)
Joseph Vuillemin, Lucent Technologies/Bell Labs. (United States)
J. Weld, Lucent Technologies/Bell Labs. (United States)


Published in SPIE Proceedings Vol. 5116:
Smart Sensors, Actuators, and MEMS
Jung-Chih Chiao; Vijay K. Varadan; Carles Cané, Editor(s)

© SPIE. Terms of Use
Back to Top