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Proceedings Paper

Polymers in RF and millimeter-wave applications
Author(s): Katia M. Grenier; Victor Lubecke; Fouad Bouchriha; Laurent Rabbia; David Dubuc; Patrick Pons; Robert Plana
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Paper Abstract

Because of their interesting electrical, mechanical and thermal properties at high frequencies, polymers are becoming more and more attractive in the development of RF and millimeterwave applications. Their process ease and characteristics indeed permit improvement in the performance of passive components as well as their integration especially with active devices. Investigated in this paper are a few technological solutions based on the use of thick polymer layers. The first one consists of a thick organic layer that may be employed as a dielectric membrane on bulk silicon micromachined substrates in order to realize suspended components, which exhibit thus very low losses and dispersion on a large frequency range. The elevation of passive circuits through thick polymers represents another attractive solution to minimize the losses induced by the silicon substrate, which through a low thermal budge provides a particularly attractive method for post-processing over active devices. The use of polymers for additional surface micromachining into coplanar slots on silicon substrates can also improve both losses and quality factor. Finally, an application using a thin polymer layer as dielectric protection for a MEMS device is described.

Paper Details

Date Published: 24 April 2003
PDF: 12 pages
Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.499052
Show Author Affiliations
Katia M. Grenier, LAAS-CNRS (France)
Victor Lubecke, Univ. of Hawaii/Manoa (United States)
Fouad Bouchriha, LAAS-CNRS (France)
Laurent Rabbia, LAAS-CNRS (France)
David Dubuc, LAAS-CNRS (France)
Patrick Pons, LAAS-CNRS (France)
Robert Plana, LAAS-CNRS (France)

Published in SPIE Proceedings Vol. 5116:
Smart Sensors, Actuators, and MEMS
Jung-Chih Chiao; Vijay K. Varadan; Carles Cané, Editor(s)

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