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Proceedings Paper

Microfluidics meets thin-film electronics: a new approach toward an integrated intelligent lab-on-a-chip
Author(s): Heiko Schafer; Steffen Chemnitz; Stephanie Schumacher; Volodymyr Koziy; Alexander Fischer; Alfred J. Meixner; Dietmar Ehrhardt; Markus Bohm
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Paper Abstract

A novel architecture for a lab-on-a-chip is presented. The architecture consists of a microfluidic system including integrated optical sensors and thin film transistors. The concept is based on the TFA (Thin Film on ASIC) technology that was developed at University of Siegen. The device consists of two substrate plates that are sandwiched together using oxygen plasma bonding. The thicker bottom plate contains the contacts to the microfluidic channels, while the thinner top plate contains the microfluidic system. The top plate is bonded face down onto the bottom substrate, and, on its reverse side, hydrogenated amorphous silicon (a-Si:H) based pin-diodes and thin film transistors (TFTs) are deposited for optical detection and data transfer. The pin-diodes and the TFTs are manufactured by PECVD (Plasma Enhanced Chemical Vapor Deposition) from silane, ammonia and dopant gases at temperatures around 200°C. Sputtered ZnO:Al is used as semitransparent front contact for the diodes, while Al and Cr are used as contacts to the transistors. The TFTs are used as switches to read out an array of pin-diodes. Experimental results for an electrokinetic microfluidic pump and the a-Si:H devices are reported. Further developments and potential applications for microanalysis are outlined.

Paper Details

Date Published: 24 April 2003
PDF: 11 pages
Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.498972
Show Author Affiliations
Heiko Schafer, Univ. of Siegen (Germany)
Steffen Chemnitz, Univ. of Siegen (Germany)
Stephanie Schumacher, Univ. of Siegen (Germany)
Volodymyr Koziy, Univ. of Siegen (Germany)
Alexander Fischer, Univ. of Siegen (Germany)
Alfred J. Meixner, Univ. of Siegen (Germany)
Dietmar Ehrhardt, Univ. of Siegen (Germany)
Markus Bohm, Univ. of Siegen (Germany)


Published in SPIE Proceedings Vol. 5116:
Smart Sensors, Actuators, and MEMS
Jung-Chih Chiao; Vijay K. Varadan; Carles Cané, Editor(s)

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