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Proceedings Paper

Compact MMIC-Compatible RF MEMS Switch
Author(s): Christopher W. Dyck; Thomas A. Plut; Christopher D. Nordquist; Garth M. Kraus; Gary D. Schmidt; Karl L. Gass; Patrick S. Finnegan; Isak C. Reines; Charles T. Sullivan
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Paper Abstract

We have fabricated and tested a surface micromachined, metal-metal contacting radio frequency microelectromechanical systems (RF MEMS) switch. The switch was fabricated out of electroplated metals on semi-insulating GaAs at process temperatures below 300°C. It was anchored by folded springs to one end of a coplanar waveguide (CPW) gap, forming a cantilever. This configuration allowed us to simplify the fabrication process by eliminating mechanical dielectric films that are normally necessary to isolate the switch contact from the actuation metal. The measured insertion loss and isolation at S band were 0.21 dB and 28 dB isolation, respectively. An average switching speed of 83 μs at 55 volts was measured. This switch demonstrated >105 cold switching cycles without sticking, however rapid increase of the contact resistance was observed. A new switch was designed to increase isolation and reduce insertion loss by decreasing the coupling capacitance and increasing the contact force.

Paper Details

Date Published: 16 January 2003
PDF: 8 pages
Proc. SPIE 4981, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II, (16 January 2003); doi: 10.1117/12.498237
Show Author Affiliations
Christopher W. Dyck, Sandia National Labs. (United States)
Thomas A. Plut, Sandia National Labs. (United States)
Christopher D. Nordquist, Sandia National Labs. (United States)
Garth M. Kraus, Sandia National Labs. (United States)
Gary D. Schmidt, Sandia National Labs. (United States)
Karl L. Gass, Sandia National Labs. (United States)
Patrick S. Finnegan, Sandia National Labs. (United States)
Isak C. Reines, Sandia National Labs. (United States)
Charles T. Sullivan, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 4981:
MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II
Siegfried W. Janson, Editor(s)

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