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Proceedings Paper

Development of high speed laser soldering process for lead-free solder with diode-laser
Author(s): Jing-bo Wang; Mamoru Watanabe; Yasuhiro Goto; Kouji Fujii; Hiroyuki Kuriaki; Masahiro Satoh; Junji Ikeda; Kozo Fujimoto
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Paper Abstract

The compactness of electronic equipments is leading the narrow pitch assembly of components on board or film by soldering. Diode-laser soldering system had already been realized as a high-density assembly process; however, the soldering quality became unstable when the system targeted to achieve short time, such as sub second, soldering, i.e. high productivity. A high speed soldering process for lead-free solder with diode-laser was developed. By measuring soldering temperature profiles of chips on film, it was found that the time period for soldering temperature reaching melting point at both sides of chip, which was over 0.6 sec, determined the soldering quality. According to SEM observation and EDS analysis, diffusion and inter-metallic layers, which were determined by plated materials of land, formed near the boundary of solder and land.

Paper Details

Date Published: 3 March 2003
PDF: 6 pages
Proc. SPIE 4831, First International Symposium on High-Power Laser Macroprocessing, (3 March 2003); doi: 10.1117/12.497966
Show Author Affiliations
Jing-bo Wang, Matsushita Industrial Equipment Co., Ltd. (Japan)
Mamoru Watanabe, Matsushita Industrial Equipment Co., Ltd. (Japan)
Yasuhiro Goto, Matsushita Industrial Equipment Co., Ltd. (Japan)
Kouji Fujii, Matsushita Industrial Equipment Co., Ltd. (Japan)
Hiroyuki Kuriaki, Matsushita Industrial Equipment Co., Ltd. (Japan)
Masahiro Satoh, Matsushita Industrial Equipment Co., Ltd. (Japan)
Junji Ikeda, Matsushita Industrial Equipment Co., Ltd. (Japan)
Kozo Fujimoto, Osaka Univ. (Japan)


Published in SPIE Proceedings Vol. 4831:
First International Symposium on High-Power Laser Macroprocessing
Isamu Miyamoto; Kojiro F. Kobayashi; Koji Sugioka; Reinhart Poprawe; Henry Helvajian, Editor(s)

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