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Proceedings Paper

Lateral CD and vertical etch depth variations due to microloading in dry etch process during photomask fabrications
Author(s): Tae Moon Jeong; Seong-Yong Moon; Seong-Woon Choi; Woo-Sung Han; Jung-Min Sohn
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Proc. SPIE 4346, Optical Microlithography XIV, ; doi: 10.1117/12.495937
Show Author Affiliations
Tae Moon Jeong, Samsung Electronics Co., Ltd. (South Korea)
Seong-Yong Moon, Samsung Electronics Co., Ltd. (South Korea)
Seong-Woon Choi, Samsung Electronics Co., Ltd. (South Korea)
Woo-Sung Han, Samsung Electronics Co., Ltd. (South Korea)
Jung-Min Sohn, Samsung Electronics Co., Ltd. (South Korea)


Published in SPIE Proceedings Vol. 4346:
Optical Microlithography XIV
Christopher J. Progler, Editor(s)

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