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Novel solder column interposer package for ACPI applications
Author(s): Raj N. Master; O. T. Ong
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Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, ; doi: 10.1117/12.495056
Show Author Affiliations
Raj N. Master, Advanced Micro Devices, Inc. (United States)
O. T. Ong, Advanced Micro Devices, Inc. (United States)


Published in SPIE Proceedings Vol. 4229:
Microelectronic Yield, Reliability, and Advanced Packaging

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