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Proceedings Paper

Measurement of residual stresses in plastic materials by electronic shearography
Author(s): Kahwah Long; Y.Y. Hung; Joseph Der Hovanesian
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Paper Abstract

This paper presents a method for measuring residual stresses in plastic materials. The approach is based on measuring the out-of-plane displacement caused by a blind hole drilled on the surface of the test object. The out-of-plane displacement is measured by electronic shearography at video camera speed and hence the results are obtained almost in real-time. Unlike holography, electronic shearography does not require special vibration isolation nor ambient light dependence. These advantageous features make the method practical for qualitative analysis of residual stresses in a production/field environment.

Paper Details

Date Published: 1 December 1991
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Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); doi: 10.1117/12.49485
Show Author Affiliations
Kahwah Long, Oakland Univ. (United States)
Y.Y. Hung, Oakland Univ. (United States)
Joseph Der Hovanesian, Oakland Univ. (United States)


Published in SPIE Proceedings Vol. 1554:
Second International Conference on Photomechanics and Speckle Metrology
Fu-Pen Chiang; Fu-Pen Chiang, Editor(s)

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