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Proceedings Paper

Process-enhanced boron penetration for sub-micron surface channel devices integrated with CoSi2
Author(s): Soh Yun Siah; Eng-Hua Lim; Ying Keung Leung; Nelson Kai Hung Lam; Ying Jin; Jia Zhen Zheng; Alan Cuthbertson
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Proc. SPIE 4181, Challenges in Process Integration and Device Technology, ; doi: 10.1117/12.494579
Show Author Affiliations
Soh Yun Siah, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Eng-Hua Lim, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Ying Keung Leung, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Nelson Kai Hung Lam, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Ying Jin, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Jia Zhen Zheng, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Alan Cuthbertson, Chartered Semiconductor Manufacturing, Ltd. (United States)


Published in SPIE Proceedings Vol. 4181:
Challenges in Process Integration and Device Technology
David Burnett; Shin'ichiro Kimura; Bhanwar Singh, Editor(s)

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